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Hi, David,

Your existing stencil manufacturer ought to be able to do it for you, or if
not, talk to any local CM's about who they use.

You want to step the bottom of the stencil - I take it you mean the step
will contact the board not the paste squeegee? Be careful doing this unless
you have a lot of real estate clearance on the board around the area of the
step, as you won't get proper stencil contact with the board until the step
"runs out". The board area between the edge of the step and the the end of
the run-put will have "mutant" solder paste deposits - wrong thickness, out
of shape, out of area, etc. The squeegee will also "form" the stencil over
the step, deforming it quickly beyond use.

The step should always be on the squeegee side, so that a uniform surface
is presented to the board. Then you will get controllable solder paste
thicknesses (that word again) wherever you want them.

Regards

Pete Duncan



                    David Simmons
                    <dave.simmons@T        To:     [log in to unmask]
                    AIT.CO.NZ>             cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
                    Sent by:               Subject:     [TN] Stepped Stencil
                    TechNet
                    <[log in to unmask]
                    G>


                    08/23/01 08:53
                    AM
                    Please respond
                    to "TechNet
                    E-Mail Forum."






Hi,
We are considering the use of a stepped stencil.
The base thickness is 5 thou and we would like the step to be 8 thou (3
thou thicker).
We would like the step to be on the bottom side of the stencil.
The total stencil size is 20 by 20 inch.
The size of the step would be about 50 * 50 mm.
Does anyone have any contacts of stencil manufacturers who can do this
for us?
Thanks
David

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