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August 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Aug 2001 13:31:10 +0800
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[This e-mail is confidential and may also be privileged. If you are not the
intended recipient, please delete it and notify us immediately; you should
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person. Thank you.]
Electrolytic plating relies on current to force the 'gift' of electrons
from the surface to be plated to the metal in solution that will become the
plating.

Electroless plating relies on potential differences between dissimilar
materials in the plating bath to move the electrons around.

Pete Duncan



                    Richard W
                    Hinebaugh            To:     [log in to unmask]
                    <[log in to unmask]        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
                    .COM>                Subject:     Re: [TN] Ni/Au Plating Question
                    Sent by:
                    TechNet
                    <[log in to unmask]
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                    08/22/01
                    10:35 PM
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I don't even know the difference between electroless and electrolytic.
Could someone explain that ?  Thanks

RICH HINEBAUGH
ECAT (ELECTRONIC ASSEMBLY AND TEST) COST ENGINEER
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