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August 2001

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Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Aug 2001 13:39:05 EDT
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Roger:

The issue is not one of uniformity of plating...I think that for connectors,
electrolytic plating is plenty uniform.

The issue is rather what Dennis Fritz alluded to, the problem of "bussing".
To electroplate, you must have a connection from the area you want plated to
the edge of the board, and often that is not feasible on many pcb designs.

Which is why most people use Electroless Nickel/Immersion Gold, you can put
that down anywhere, on any design.

You always want to use electroplating where you can, Electroless plating is
what you use when you cannot electroplate.

Rudy Sedlak
RD Chemical Company

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