Ok all you plating guru's.......I am currently specifying a gold
(Thermosonic) wire bondable electrolytic gold for a new board design.
This in my mind was the easy part (Mil G-45204, Type III, Grade A, 40-50
microinches thick).    Now for the Nickel,   Currently we spec. a
Electrolytic Ni, 4-9% Phos., 150-200 microinches thick. 

Questions:  Since my bonding is to the gold, is there a concern if the
Ni plating is Electroless or Electrolytic.  Which is easier to control ?
Which is a less expensive process ?  Any other concerns I should be
aware of ?

Thanks,
Bill C.

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