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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 22 Aug 2001 08:01:10 -0400 |
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Genny, Michael
Interesting design and a workable solution. They mention a method that might work for Genny as well with her existing product - dispense a thermally conductive adhesive onto the board and place the part on it - I'd much prefer that to the idea of putting a thermally conductive pad on the part or board - with the adhesive you are more sure the placement coplanarity will be OK. And easier than my suggestion of an underfill!
regards
Graham Collins
Process Engineer,
Litton Systems Canada, Atlantic Facility
A Business Unit of Northrop Grumman
(902) 873-2000 ext 6215
>>> [log in to unmask] 08/22/01 08:42AM >>>
If the part your dealing w/ is TI or similar, check out the link below.
http://www.ti.com/sc/docs/package/related.htm
Go to "PowerPad Thermally Enhanced Package Application Report"
Michael Kuczynski Sr. Designer/Librarian
Philips Components LCoS Project
345 Scarborough Rd. 1-914-945-6346 (Ph)
Briarcliff Manor, NY 10510-2099 1-914-945-6798 (Fax)
[log in to unmask]
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