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August 2001

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Subject:
From:
"Dorothy M. Lush" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Aug 2001 13:23:56 -0700
Content-Type:
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text/plain (64 lines)
Who is the maker of the solder paste and what is its name?  We have been
having this problem also where we have not had it before.

Solder balls are formed by: misprinting, too much solder paste, reflow
profile, solder paste slump(ability), crappy solder paste. Take your pick.

Dorothy Lush

> ----------
> From:         Jorge Rodriguez[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Tuesday, August 21, 2001 11:57 AM
> To:   [log in to unmask]
> Subject:      Solder Beads (not solder balls)
>
> Fellow technetters,
>
> We are having tons of issues with solder beading, even on boards were we
> didn't have the issue before. We're clueless, we suspect of the solder
> paste
> (63-37 Water Soluble), it looks slumpy amd watery, but we're not sure. I
> know solder beading can be solved by designing the stencils with home-base
> aperture, but what we're seeing here is across the board, not just one
> particular assembly but several. Does anyone have experience dealing with
> an
> issue like this?, could solder beading caused by the oven profile or is it
> more like solder paste related?
>
>
> Any comments would be appreciated.
>
>
> Jorge Rodriguez
> Process Engineer
> Varian Electronics Manufacturing
> E-mail: [log in to unmask]
>
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