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August 2001

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Subject:
From:
Bartkowaik Christine <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Aug 2001 15:34:39 -0400
Content-Type:
text/plain
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text/plain (71 lines)
Jorge:

This can be caused by:
a)      Too slow a ramp rate.
b)      Excessive paste deposit during printing.

Chris

        -----Original Message-----
        From:   Jorge Rodriguez [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 21, 2001 2:57 PM
        To:     [log in to unmask]
        Subject:        [TN] Solder Beads (not solder balls)

        Fellow technetters,

        We are having tons of issues with solder beading, even on boards
were we
        didn't have the issue before. We're clueless, we suspect of the
solder paste
        (63-37 Water Soluble), it looks slumpy amd watery, but we're not
sure. I
        know solder beading can be solved by designing the stencils with
home-base
        aperture, but what we're seeing here is across the board, not just
one
        particular assembly but several. Does anyone have experience dealing
with an
        issue like this?, could solder beading caused by the oven profile or
is it
        more like solder paste related?


        Any comments would be appreciated.


        Jorge Rodriguez
        Process Engineer
        Varian Electronics Manufacturing
        E-mail: [log in to unmask]


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