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August 2001

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Subject:
From:
Jorge Rodriguez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Aug 2001 11:57:00 -0700
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Fellow technetters,

We are having tons of issues with solder beading, even on boards were we
didn't have the issue before. We're clueless, we suspect of the solder paste
(63-37 Water Soluble), it looks slumpy amd watery, but we're not sure. I
know solder beading can be solved by designing the stencils with home-base
aperture, but what we're seeing here is across the board, not just one
particular assembly but several. Does anyone have experience dealing with an
issue like this?, could solder beading caused by the oven profile or is it
more like solder paste related?


Any comments would be appreciated.


Jorge Rodriguez
Process Engineer
Varian Electronics Manufacturing
E-mail: [log in to unmask]

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