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August 2001

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Subject:
From:
"Chafin, Ken G." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Aug 2001 13:45:10 -0400
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Thanks to all of you for the continuing information and discussion on this
subject.

I have requested a precise, technical specification of the gold finish from
our supplier so that we can make intelligent use of all the thoughtful and
relevant information being provided by you.

Thanks again.

> -----Original Message-----
> From: Chafin, Ken G.
> Sent: Monday, August 20, 2001 2:31 PM
> To:   [log in to unmask]
> Subject:      Solder vs Gold Pads on SMT
>
> We presently use SMT printed wiring boards with 60/40 tin-lead solder
> finish on the pads.
>
> Our PWB supplier has offered to supply our boards with a 30 micron
> electroless gold finish on the pads at the same price.
>
> Does anyone have any views on the relative merits of the two finishes?
> Solderability?  Durability?  Reliability?
>
> We manufacture electronic control and signaling systems for the rail and
> rapid transit industry and our equipment is often in harsh environments.
>
> Thanks for any information on the subject.

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