Miguel,

We actually experimented with this about 10 years ago to compensate for less
than optimal placement of an old Dynapert.  The process was rejected due to
the detrimental effects on the structure and integrity of the solder joint.
Even with control of the timing, you basically end up shaking the solder
joint as it's trying to solidify.  Just my opinion, but I would think that
any current pick-and-place equipment should be able to place accurately
enough that you shouldn't need to help the part center itself.

Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Miguel Vallejo
Sent: Tuesday, August 21, 2001 9:18 AM
To: [log in to unmask]
Subject: [TN] self-centering SMT


I appreciate if the group can provide information on the following:
I heard about a vibratory device that transfers vibes to the conveyor of a
re-flow oven, and in turn to the PCB, to cause the components to
self-center.
Where can I find information for this devices?
Anyone had any negative experience with this process?
My concern is if the vibration can produce a wicker solder joint structure
at solidification. Any comments?
Thanks for your help.

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