Dougal,

If your application is higher frequency RF your RF designer might have a
definite opinion as to the width of pad and length of gap between the pads
on a component by component basis. I believe it is dependent on the
dielectric constant(s) and the like. Of course if the component(s) in
question are not in an RF circuit a more process friendly layout can be
adopted. You might consider not having solder mask in the gap between the
pads for various process and quality reasons. By the way, I am assuming you
are using a no-clean paste.

Dorothy Lush

> ----------
> From:         Stewart, Dougal[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Tuesday, August 21, 2001 7:14 AM
> To:   [log in to unmask]
> Subject:      design pads for chip resistors and capacitors
>
> Could someone tell me the land size for 0402 and 0201 chip components
> thankyou
> Dougal Stewart
> Director of Technology Development,
> Viasystems Europe
> tel:   +44 191 206 2081
> mob:+44 780 221 1958
>
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