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August 2001

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Subject:
From:
Dean Lillibridge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Aug 2001 12:07:00 -0400
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FOR 0402: IPC-SM-782 SUBSECTION 8.1(CHIP RESISTORS), 8.2 (CHIP
CAPACITORS)call for 2.mm min and 2.2 mm max from the far edges of the pads
("z" dimension per IPC). Inside spacing of pads to be .4mm min to .6mm max
("G" dimension per IPC.) Individual length of pads would be .6mm min to .8mm
max. ("X" dimension per IPC).  Individual width of pad would be .8mm min to
.9mm (IPC "Z" dimension minus "g" dimension.(BUT is recommended at .9mm per
their "y" dimension.  Dimension from center of pad to center of opposite pad
is 1.3mm (IPC "C" dimension).

still looking for 0201 update dims.

                                --Dean Lillibridge
                                NEWvENTURE TECHNOLOGIES

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stewart, Dougal
Sent: Tuesday, August 21, 2001 10:15 AM
To: [log in to unmask]
Subject: [TN] design pads for chip resistors and capacitors


Could someone tell me the land size for 0402 and 0201 chip components
thankyou
Dougal Stewart
Director of Technology Development,
Viasystems Europe
tel:   +44 191 206 2081
mob:+44 780 221 1958

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