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| Reply To: | TechNet E-Mail Forum. |
| Date: | Tue, 21 Aug 2001 08:58:04 -0700 |
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Dougal,
I have no experience with 0201 but for
0402 used on Flex Circuits I use .025x .024 , pads spaced .036 from center of pad to
center of pad.
Then cover the .025 end with .005 of kapton. So you are left with .020x.024 exposed pad.
This was a very tight design and we shrank pad sizes on all chip components.
0402 used on Rigid boards I use .028 x.028, pads spaced on .050 center.
check out IPC-SM-782 Surface Mount Design and Land Pattern Standard. October 1996
IPC has greatly improved their formula for land pattern design. For the most part we use the
standard.
Only when density really pushes us to investigate smaller pads do we deviate.
Regards,
Greg Scott
Cray Inc.
"Stewart, Dougal" wrote:
> Could someone tell me the land size for 0402 and 0201 chip components
> thankyou
> Dougal Stewart
> Director of Technology Development,
> Viasystems Europe
> tel: +44 191 206 2081
> mob:+44 780 221 1958
>
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