Dorothy and Wolfgang,
The misplacement is actually misalignment of one of the component terminal with respect to the solder land and it usually occurs after reflow soldering. Note that we performed 100% inspection prior reflow to check the component placement and found it
to be correct. We maintain a humidity level between 40 to 60 %.
Leonel Jay J. Manuel
Process Engineer
RF PCC Engineering
Philips Semiconductors Phils. Inc.
Office Tel: (6349) 5430001 to 25
: (632) 8445139 ext. 288
Fax No. : (632) 8445248 / (6349) 5430027
E-mail :[log in to unmask]
"Busko, Wolfgang" <[log in to unmask]>@IPC.ORG> on 08/16/2001 04:33:53 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Leonel Jay J Manuel/CUB/SC/PHILIPS)
Subject: [TN] AW: [TN] Misplace component
Classification:
Hi Dorothy,
you should have asked Leonel. I just tried to give some hints what could be
checked in addition to avoid "misplace".
I also don´t know how that actually looks like in his special case, a
picture in this case would be worth a thousand words.
It´s obvious that without seeing the problem live all our guessing is like
paddling in fog.
Have a nice day
Wolfgang
-----Ursprüngliche Nachricht-----
Von: Dorothy M. Lush [mailto:[log in to unmask]]
Gesendet am: Mittwoch, 15. August 2001 19:46
An: [log in to unmask]
Betreff: Re: [TN] Misplace component
Wolfgang,
What do you mean by "misplaced"?
Do you mean it is missing?
Do you mean it is tombstoning?
Do you mean it is misaligned?
Do you mean it is in the wrong location?
Dorothy Lush
> ----------
> From: Busko, Wolfgang[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.
> Sent: Wednesday, August 15, 2001 4:22 AM
> To: [log in to unmask]
> Subject: AW: [TN] Misplace component
>
> Hi Leonel,
>
> if the processes are checked already and there seems to be no cause you
> might check your checks and focus on the results, if they clearly show
> that
> the particular process is definetly not the cause.
>
> For the solderability of bare boards and parts, there´s always a good
> portion of trust in solderability of a whole batch after checking some
> samples.
>
> Cleanliness is another major factor in this game, how is the handling
> done,
> is the dust removed prior to paste print (there´s always some of it right
> out of the sealed package), for how long do the printed boards wait until
> beeing reflowed, and what about temperature and humidity at these hot
> summer
> days, does your paste like it as it is now?
>
> Just a couple of things which I think can contribute to that what you´re
> seeing.
> If it happened suddenly, can you find out what has changed?
>
> Good luck
> Wolfgang
>
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