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August 2001

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Subject:
From:
John Fahey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Aug 2001 14:09:56 -0700
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Thank you all very much. This is excellent information and really helps when
putting a process together.

Regards,
John

John Fahey
Manufacturing Engineer
Echelon Corp

415 Oakmead Parkway
Sunnyvale
CA 94085
[log in to unmask]
Phone: 408 938 5330
Fax:     408 328 3804



-----Original Message-----
From: Phil Nutting [mailto:[log in to unmask]]
Sent: Thursday, August 16, 2001 2:05 PM
To: [log in to unmask]
Subject: Re: [TN] ''Encapsulating/Potting PCB Assemblies"


Phil,

You are 100% right.  We had an assembly the would fracture a Torroid
with a 1/2 inch cross section as the epoxy cured.  We fixed it by
putting in a 1½ inch diameter "relief plug" made of rubber molding
compound next to the torroid.  This eliminated the stress caused by the
epoxy shrinkage.

Another possible item is next level of assembly.  We put some potted
assemblies in dielectric oil.  The oil can do funny things to different
materials.  It causes polyolefin heat shrink to get soft and squishy.
And uncured RTV, what a mess it causes as is dissolves and coats
everything.

Phil

-----Original Message-----
From: Crepeau, Phil [mailto:[log in to unmask]]
Sent: Thursday, August 16, 2001 4:28 PM
To: [log in to unmask]
Subject: Re: [TN] ''Encapsulating/Potting PCB Assemblies"


hi,

you got some really terrific suggestions.  if i overlooked a similar
response as mine, i apologize.  what you need to be aware of is the
importance of selecting a potting compound that won't shrink much during
cure and that won't fracture during any temperature cycling that your
potted assembly may be exposed to.  stresses on potted magnetic
components may change their performance.

phil

-----Original Message-----
From: John Fahey [mailto:[log in to unmask]]
Sent: Thursday, August 16, 2001 7:57 AM
To: [log in to unmask]
Subject: [TN] ''Encapsulating/Potting PCB Assemblies"


I have recently come upon a requirement to encpasulate/pot a small PCB
assy
containing a T/H transformer. Size is approx .5"W x .5"L x .3" H

Can anyone who has experience in "Potting" or "encapsulating"
technologies ,especially potting PCB assemblies, give me some
hints/starting points, etc.

I would be very interested in any issues to watch out for, recommended
potting materials, equipment, standards to adhere to, tests, etc.
Basically anything that would be helpful.

Thanks in advance,
John

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