Thank you Brent!
I see that engaging typing fingers before engaging brain is not a good idea!
Should have had my Starbuck's coffee before hitting the keys this AM! I was
typing an electroless nickel question and thinking immersion gold chemisty.
What I should have asked is:
What is the typical electroless deposition thickness specified for
electroless nickel/immersion gold for SMT application? Does this vary with
the class of board being produced; class 3 requires tighter tolerance or
some set minimum, etc.
Thank you for your input,
Jana Carraway
Micro Systems Engineering, Inc.
Lake Oswego, Oregon
503-635-4016 ext 1180
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Alcorn, Brent
Sent: Thursday, August 16, 2001 10:01 AM
To: [log in to unmask]
Subject: Re: [TN] Easy Thursday Question!
If this is for a final gold plating then we typically call out 50 to 150
micro inches for electroless nickel and then 3 to 8 micro inches of
immersion gold.
Regards,
Brent
-----Original Message-----
From: Jana L. Carraway [mailto:[log in to unmask]]
Sent: Thursday, August 16, 2001 12:20 PM
To: [log in to unmask]
Subject: [TN] Easy Thursday Question!
As we do not do manufacturing at this site, I have no technical data sheets
handy - so I need to ask a quick and easy question! (I haven't found the
answer on supplier's websites and have a couple calls into suppliers, but
you know how long that can take to get feedback - just kidding guys, I know
everyone is busy these days)
My question is: What is the typical electroless nickel deposition thickness?
I'm thinking it's around 3-5 microns. Is that correct? What range is given
on the technical literature from suppliers, if any of you guys has a tech
data sheet handy?
Thank you for your help!
Jana Carraway
Micro Systems Engineering, Inc.
Lake Oswego, Oregon
503-635-4016 ext 1180
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