TECHNET Archives

August 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Fahey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Aug 2001 09:56:32 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
I have recently come upon a requirement to encpasulate/pot a small PCB assy
containing a T/H transformer. Size is approx .5"W x .5"L x .3" H

Can anyone who has experience in "Potting" or "encapsulating"
technologies ,especially potting PCB assemblies, give me some
hints/starting points, etc.

I would be very interested in any issues to watch out for, recommended
potting materials, equipment, standards to adhere to, tests, etc.
Basically anything that would be helpful.

Thanks in advance,
John

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2