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August 2001

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Aug 2001 15:10:02 -0500
Content-Type:
text/plain
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text/plain (186 lines)
Point well taken Neil.  I have occasionally, over the last 25 years, received some rather
bogus looking numbers on my monthly solder analysis reports.  I ask for a retest in these
situations.  In all cases, the numbers on the retest are more in line with expectations.

Monthly solder analysis my seem excessive but I'll bet the annual cost is less than what
marketing spends for golf balls in a month. ;^}

Gary Camac

Neil Atkinson wrote:

> As no-one on the Technet has ever seen a copper content this high before
> (there are a lot of experienced people out there) - is it worth checking
> your analysis by getting a second opinion - maybe something has gone wrong
> somewhere?!?!?
>
> We carry out regular analysis but we rarely have a failure and copper
> content has never been an issue even on an old roller tinner in our PCB
> plant (it obviously sees nothing but bare copper) so it seems as if
> something is wrong somewhere!
>
> Neil Atkinson - Quality Manager
> Stadium Electronic Controls Division
> Stephen House, Brenda Road, Hartlepool TS25 2BQ (UK)
>
>              -----Original Message-----
>              From:   Phil Nutting [mailto:[log in to unmask]]
>              Sent:   15 August 2001 15:18
>              Subject:        Re: Solder analysis results
>
>              Wow, The overwhelming solution is to lower the pot
> temperature and skim
>              it off the top. This will have to be a project for an
> up-coming weekend
>              or evening.
>
>              I think somebody asked how long it has been since our last
> analysis or
>              did we drop pennies into the pot.  The truth is (hanging
> head in shame)
>              we have been running the machine for 5 years and this is the
> first
>              analysis we have performed... to quote Steve Gregory -
> Woooo-doggies!
>              With age we all get smarter and I've just been enlightened.
>
>              Thanks to all of you for your responses.
>
>              Phil Nutting
>
>              -----Original Message-----
>              From: Lou Hart [mailto:[log in to unmask]]
>              Sent: Wednesday, August 15, 2001 9:21 AM
>              To: [log in to unmask]
>              Subject: Re: [TN] Solder analysis results
>
>              Any comment on Steve's stratification theory?  A few years
> back I had
>              SPC
>              charts at a HASL pot at a PC fab, with analysis every two
> weeks.  Cu
>              content stayed 0.21% to 0.24% over a period of 1+ years,
> even though all
>              we
>              were doing was skimming stuff off the top.  Lou Hart
>
>              -----Original Message-----
>              From:   Stephen R. Gregory [SMTP:[log in to unmask]]
>              Sent:   Tuesday, August 14, 2001 10:04 PM
>              To:     [log in to unmask]
>              Subject:        Re: [TN] Solder analysis results
>
>              Dave,
>
>              Surely, not ALL 1700-lbs.? Wooo-doggies! I can only imagine
> what a task
>              that
>              would be!!! I've read some stuff that if you keep the pot
> static, and
>              keep
>              it
>              at a stable temperature for a period (what this really is, I
> don't
>              know...there's varying opinions), the metals will seek their
> own level
>              (according to the different opinions, the copper will be
> towards the
>              top),
>              then you scoop out out the top layer, and replenish what
> you've removed
>              with
>              fresh bars.
>
>              The question that I have though, how did the pot get so out
> of balance
>              with
>              copper? I've never had a problem with copper content, even
> when waving
>              OSP
>              boards...tin levels dropping, yes. But not excessive
> copper...somebody
>              throw
>              some pennies in the pot?
>
>              -Steve Gregory-
>
>              > RJ Klien Wassink suggests [bible p 169] pouring
> contaminated solder at
>              about
>              > 190°C through a 20 mesh stainless steel stariner to reduce
> copper
>              content
>              to
>              > 0.25%.
>              >
>              > Dave Fish
>              >
>
>               << File: ATT00002.htm >>
>
>
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