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August 2001

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Aug 2001 13:22:27 +0200
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Hi Leonel,

if the processes are checked already and there seems to be no cause you
might check your checks and focus on the results, if they clearly show that
the particular process is definetly not the cause.

For the solderability of bare boards and parts, there´s always a good
portion of trust in solderability of a whole batch after checking some
samples.

Cleanliness is another major factor in this game, how is the handling done,
is the dust removed prior to paste print (there´s always some of it right
out of the sealed package), for how long do the printed boards wait until
beeing reflowed, and what about temperature and humidity at these hot summer
days, does your paste like it as it is now?

Just a couple of things which I think can contribute to that what you´re
seeing.
If it happened suddenly, can you find out what has changed?

Good luck
Wolfgang

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