You will want to take another sample after doing this.  As you cool the pot
the heavier metals (i.e. lead) will drop.  When you remove the dross you
will be removing tin also and could change the Sn/Pb ratio.  You can buy
pure tin to add back in to correct this.

-----Original Message-----
From: Edward Szpruch [mailto:[log in to unmask]]
Sent: Tuesday, August 14, 2001 11:35 AM
Subject: Re: Solder analysis results


Phil,
Copper content is 5.5 times higher that should be.
Try to remove the excess copper by veeery slow cooling of your solder pot in
static conditions.Around 190 centigrade you should get the first dross on
the surface ,which is very rich in copper.Take it out.
Good luck
Edward

Edward Szpruch
Eltek , Manager of Process Engineering
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: Phil Nutting [SMTP:[log in to unmask]]
> Sent: â àåâåñè 14 2001 14:48
> To:   [log in to unmask]
> Subject:      [TN] Solder analysis results
>
> Ok folks, here is today's question.
>
> I just received a Certificate of Analysis (our first one) for the solder
> in our Soltec Waver Solder machine.  All parameters are "within
> specification" except the percentage of copper which is at 1.6859. (Tin
> is at 61.3% and Lead is at 36.99% and other stuff is at 0.0199%)  We run
> 63/37 in the wave.  We only solder our own product, none of which goes
> into "mission critical" applications.  We normally build our product to
> IPC-A-610C, Class 2.
>
> My question is two-fold.  Should I worry about this?  If so, how do I
> fix it with 1700 pounds of solder in the solder pot?
>
> Thanks is advance for sharing your knowledge.
>
> Phil Nutting
> Manufacturing Engineer
> Kaiser Systems, Inc.
>
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