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August 2001

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Aug 2001 11:44:01 -0400
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There was a post on this last year. I have not tried the fix but, you are
supposed to be able to precipitate some of the copper out by cooling the pot
to close to the eutictic point. Scrape the sludge out. I suggest you take a
look at the archives.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Tuesday, August 14, 2001 8:48 AM
To: [log in to unmask]
Subject: [TN] Solder analysis results


Ok folks, here is today's question.

I just received a Certificate of Analysis (our first one) for the solder
in our Soltec Waver Solder machine.  All parameters are "within
specification" except the percentage of copper which is at 1.6859. (Tin
is at 61.3% and Lead is at 36.99% and other stuff is at 0.0199%)  We run
63/37 in the wave.  We only solder our own product, none of which goes
into "mission critical" applications.  We normally build our product to
IPC-A-610C, Class 2.

My question is two-fold.  Should I worry about this?  If so, how do I
fix it with 1700 pounds of solder in the solder pot?

Thanks is advance for sharing your knowledge.

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.

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