Technetters,

I ran into an interesting item the other day that I would appreciate a
sanity check on.  I realize that this is a rather oblique question for this
forum, but there are other (silent) hybrid types out there (I believe).



Most of the bare silicon die that I have used in the past have either been
grey-backed (bare silicon), gold-silicon (eutectic), or chrome-nickel-silver
(power mosfets).

I have recently encountered a supplier that uses aluminum (alloyed) for
back-side contact of generic, none speciallized, silicon devices.  Has
anyone else encountered this as well?  If so, have you observed any contact
resistance problems when used with normal silver-filled conductive
adhesives?

It makes sense that it would form an ohmic contact to the back-side of the
wafer - just never ran into an aluminum metallized back-side before....

.. Just wanted to know if my head has been .... in the sand.   (Will post on
ChipNet as well)

Thanks

Steve Creswick - Gentex

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