Sounds like amoung other things you have a solder fluxer problem, I.E you
aren't getting any because the nozzle is clogged, not moving and/or maybe
the the fluxer was not purged when the solderwave process changed from
aqueous to no-clean or vice versa and you have mixed fluxes.

Dorothy

> ----------
> From:         Kathy Bergman[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Kathy Bergman
> Sent:         Friday, August 10, 2001 10:59 AM
> To:   [log in to unmask]
> Subject:      Solder conditions
>
> I am looking to get some help in identifying the causes of certain post
> wave
> solder conditions. In particular, a "cracked ice" effect in which the very
> surface of the solder looks like a thin layer of it has been cracked in
> the
> way that ice would crack. Another one is lumpy solder, as if the solder
> had
> dirt in it. (I know it doesn't). I am a board manufacturer with just a
> minimum of assembly knowledge.
> I am unable to post a good picture of the conditions at this time. I
> am wondering if there are some on line resources I can tap into, to see
> some
> visual examples of these and other conditions.
> Also, what would be a normal wave profile for a board such as this: .093
> thick FR4, through hole technology, approx. 6x11, .025 to .195 sized
> holes,
> HASL finish. Please include any prebake information.
> I apprectiate in advance any help I can get.
> Kathy Bergman
>
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