TECHNET Archives

August 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kathy Bergman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Aug 2001 12:59:35 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
I am looking to get some help in identifying the causes of certain post wave
solder conditions. In particular, a "cracked ice" effect in which the very
surface of the solder looks like a thin layer of it has been cracked in the
way that ice would crack. Another one is lumpy solder, as if the solder had
dirt in it. (I know it doesn't). I am a board manufacturer with just a
minimum of assembly knowledge.
I am unable to post a good picture of the conditions at this time. I
am wondering if there are some on line resources I can tap into, to see some
visual examples of these and other conditions.
Also, what would be a normal wave profile for a board such as this: .093
thick FR4, through hole technology, approx. 6x11, .025 to .195 sized holes,
HASL finish. Please include any prebake information.
I apprectiate in advance any help I can get.
Kathy Bergman

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2