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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 21 Aug 2001 10:11:21 -0700 |
Content-Type: | text/plain |
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Dougal,
If your application is higher frequency RF your RF designer might have a
definite opinion as to the width of pad and length of gap between the pads
on a component by component basis. I believe it is dependent on the
dielectric constant(s) and the like. Of course if the component(s) in
question are not in an RF circuit a more process friendly layout can be
adopted. You might consider not having solder mask in the gap between the
pads for various process and quality reasons. By the way, I am assuming you
are using a no-clean paste.
Dorothy Lush
> ----------
> From: Stewart, Dougal[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.
> Sent: Tuesday, August 21, 2001 7:14 AM
> To: [log in to unmask]
> Subject: design pads for chip resistors and capacitors
>
> Could someone tell me the land size for 0402 and 0201 chip components
> thankyou
> Dougal Stewart
> Director of Technology Development,
> Viasystems Europe
> tel: +44 191 206 2081
> mob:+44 780 221 1958
>
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