LEADFREE Archives

August 2001

Leadfree@IPC.ORG

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Subject:
From:
Lynn Norman <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 1 Aug 2001 11:25:16 -0500
Content-Type:
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Both aerospace and automotive companies are running to embrace lead-free
technology on the basis that it could get them out of this thermal
management bind. Ford have already made the jump.

Working in the automotive electronic industry, I can tell you that we AREN'T
"running to embrace lead-free".  On the contrary we are against it.  The
main reason we're evaluating lead-free is purely market driven.  We have
test data that shows the SAC alloy is much less reliable at high (underhood)
temperatures and with longer dwell times.  We won't start manufacturing
modules for underhood applications with lead-free until we are forced to.

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