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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 16 Aug 2001 09:47:54 -0700 |
Content-Type: | text/plain |
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John,
The most pressing question that needs to be answered is "why". The answer will determine the
type, amount, process and testing required.
It is apparent this "encpasulate/potting" requirement is based on some form of end use
problem. The nature and extent of the end use issues will be the determining factor.
David A. Douthit
Manager
LoCan LLC
-------------------------------------
John Fahey wrote:
> I have recently come upon a requirement to encpasulate/pot a small PCB assy
> containing a T/H transformer. Size is approx .5"W x .5"L x .3" H
>
> Can anyone who has experience in "Potting" or "encapsulating"
> technologies ,especially potting PCB assemblies, give me some
> hints/starting points, etc.
>
> I would be very interested in any issues to watch out for, recommended
> potting materials, equipment, standards to adhere to, tests, etc.
> Basically anything that would be helpful.
>
> Thanks in advance,
> John
>
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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