The word "all" is in Section 5.4 of J-STD-001C requires that the storage
conditions must not degrade the solderability any of the various types of
components used in the manufacturing sequences. The manufacturer is
responsible to know this is the case not just for lugs and terminals, for
example, but also for PWBs (including those protected by the various
alternatives to tin-lead), and components. This requirement also extends to
materials that have been issued from stores to the floor in large quantities
and may sit in a different environment from the stockroom.
I believe that J-STD-002A supports this position. Consider this excerpt from
Section 1.2: Determination of solderability can be made at the time of
manufacture, at receipt of the components by the user, or just before
assembly and soldering. Section 1.4 Coating Durability provides the user
with the opportunity to express requirements to vendors.
Category 1 - Intended for surfaces which will be soldered within a short
period of time (e.g., up to six months) from the time of testing and are
likely to experience a minimum of thermal exposures before soldering.
Category 2- Intended for surfaces finished with other than Sn or Sn/Pb
coatings which will be soldered after an extended time from the time of
testing and which may see limited thermal exposures before soldering.
Category 3- Intended for surfaces finished with Sn or Sn/Pb coatings which
will be soldered after an extended storage.
Why develop a set of solderability tests that ensure solderability for many
months and then set a requirement demanding re-testing at the time of use?
Granted, Section 5.8 of J-STD-002A admits that the tests can not accurately
predict storage life. It remains clear to me that the intent of the authors
of the standards was to provide maximum flexibility and minimum requirements
for testing.
Guy Ramsey
Senior Lab Technician / Instructor
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Fish
Sent: Tuesday, July 10, 2001 12:01 AM
To: [log in to unmask]
Subject: Re: [TN] J-STD-002 and -003 solderability testing...
Guy,
Under your interpretation, what is the application and intent of the word
"ALL" as used in J-STD-001C, 5.4 Solderability Maintenance?
Dave Fish
----- Original Message -----
From: Guy Ramsey <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, July 06, 2001 9:21 AM
Subject: Re: [TN] J-STD-002 and -003 solderability testing...
> That is not how I interpret 5.4. I discussed this with one of our Master
> Instructors, we interpret 5.4 as a requirement ensuring that your handling
> and storage methods have not degraded solderability. It does not suggest
how
> you should do this nor is there a requirement for objective evidence.
>
> Perhaps you could store coupons with comparable finishes and record test
> results, there may be even simpler ways. If material in your process is
> known to pass J-STD-002 and is less than 6 months old and you can show
good
> solderability on sample material that is one year old. I suggest you have
> complied with 5.4. Just remember your process control system must be
> available for review and is subject to approval by your customer.
>
>
> Guy Ramsey
> Senior Lab Technician / Instructor
>
>
> E-Mail: [log in to unmask] <mailto:[log in to unmask]>
> Ph: (610) 362-1200 x107
> Fax: (610) 362-1290
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of David Fish
> Sent: Thursday, July 05, 2001 10:51 PM
> To: [log in to unmask]
> Subject: Re: [TN] J-STD-002 and -003 solderability testing...
>
>
> Guy,
>
> We agree that if all we had was J-STD-001C, 5.2 Solderability, we probably
> would not be having this conversation.
>
> . but we do have J-STD-001C, 5.4 Solderability Maintenance. We also agree
> that 5.4 applies to components, parts, etc. that come from the stockroom,
> kitting, component prep, sequencing, machine insertion, machine placement,
> hand insertion, or similar areas up-stream of all soldering processes.
>
> 5.4 says that if you don't solder the components, parts, etc. that you
> checked for solderability in 5.2 right away, but instead put them in a
> stockroom, kitted them, prepared them, sequenced them, machine inserted
> them, machine placed them, hand inserted them, or similar things; then you
> need to check the solderability of every component, part, etc. that you
did
> those things to prior to starting a soldering operation on that component,
> part, etc.
>
> Dave Fish
>
> --------------------------------------------------------------------------
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