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Date: | Mon, 9 Jul 2001 09:11:52 -0500 |
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Hello.
1. Can't tell you without looking at it or having more information.
2. The blow hole acceptance depends on the size of the blow hole and how much the blow hole affects the solder joint criteria as shown in table 6-2 of the IPC-610 Rev C. If the solder joint still meets the criteria of the minimum joint requirements as specified the solder joint is acceptable. If the blow hole also includes a projection at all then the projection will have to be judged for maximum height protrusion per table 6-1 or if the projection violates minimum electrical clearance. (See 6.5.5)
3. Acceptable joint = no, rework; Unacceptable = yes, rework.
Kathy
>>> [log in to unmask] 07/09/01 06:10AM >>>
Hi folks,
We encountered "blowholes" occurring on our PCB Assembly after wave
soldering. And the cross-section pictures show out, there's no void in the
through-hole, and the excess solder(solder ball)on the soldering side of
the board connects the inner solder of through-hole directly. Now I have
some questions about the "blowhole":
1. Is it real blowhole?
2. According to IPC standards, the process phenomena can be recognized as
process-defect or process-indicator? And will you help to tell me the
detailed lines in IPC which used for supporting your conclusion.
3. What's your recommendation about the excess-solder reworking on the
board? Or no need for reworking?
If received your response, I can sent the picture to you respectively for
your reference.
Thanks in advance.
Best regards,
zhang shoukai
PE, Huawei Technologies
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