We didn't eliminate solderability testing, we never did it! Prior to using
OA flux, we used RA, which probably accounts for our solderability success.
We are located in north eastern US (Long Island), so humidity can be a
problem during summer months. Our components are usually stored in sealed
ESD bags in a factory environment (no air conditioning or humidity
controls). Since we are usually waiting for suppliers to deliver,
components aren't stored that long. We do not impose a shelf life, though.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Joyce Koo [SMTP:[log in to unmask]]
Sent: Monday, July 09, 2001 9:17 AM
To: [log in to unmask]
Subject: Re: [TN] J-STD-002 and -003 solderability testing...
Jim,
are you going to eliminate solderability test only for OA flux
assembly like yours, or for everything (including no-clean)? Where are you
located? How is your component stored for how long (maximum allowed)? What
is the surface finishing (HASL)? What is the pitch size (smaller pitch may
have exposed edges due to lead forming techniques)? What is the local
humidity condition (we do know that AZ has better chance to pass
solderability test than South Asia China Sea region after 6 month of storage
in "in-door" condition...off-the shelf)...Most of components are from
distributor now... how about after market parts?
jk
-----Original Message-----
From: Marsico, James [ mailto:[log in to unmask]
<mailto:[log in to unmask]> ]
Sent: July 9, 2001 7:56 AM
To: [log in to unmask]
Subject: Re: [TN] J-STD-002 and -003 solderability testing...
Being a military contractor, most of our contracts are still to
MIL-STD-2000
or our own internal specification which mirrors 2000. For many
years we've
been toying with the idea of switching to J-STD-001, but the same
problem
keeps reoccurring, paragraph 5.4. Being on the IPC Soldering Task
Group, I
once tried to have 5.4 amended to include something like a history
of having
no solderability problems is an acceptable means of ensuring that
the
components are solderable at the start of the soldering process.
This
request was denied... I forget the justification.
Well, here we are, not performing solderability tests at Receiving
Inspection, not storing our parts in dry nitrogen or a controlled
environment, not ensuring that the parts are solderable at the start
of the
soldering processes, but not having ANY solderability issues.
(We've been
using OA flux for about 6 years now and I can't recall any soldering
defects
which were attributed to solderability.) Yet, we can't officially
claim to
be able to meet the requirements of J-STD-001! So, we continue to
request
that our internal workmanship document be included on contracts in
lieu of
any industry (or government) standards.
It seems like many have an interpretation problem with paragraph
5.4. The
handbook isn't very helpful either with regard to this paragraph.
Perhaps
revisiting the solderability requirements (and solderability
maintenance)
should be considered for the next revision of J-STD-001.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] < mailto:[log in to unmask]
<mailto:[log in to unmask]> >
631-595-5879
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