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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 9 Jul 2001 06:10:30 -0500 |
Content-Type: | text/plain |
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Hi folks,
We encountered “blowholes” occurring on our PCB Assembly after wave
soldering. And the cross-section pictures show out, there’s no void in the
through-hole, and the excess solder(solder ball)on the soldering side of
the board connects the inner solder of through-hole directly. Now I have
some questions about the “blowhole”:
1. Is it real blowhole?
2. According to IPC standards, the process phenomena can be recognized as
process-defect or process-indicator? And will you help to tell me the
detailed lines in IPC which used for supporting your conclusion.
3. What’s your recommendation about the excess-solder reworking on the
board? Or no need for reworking?
If received your response, I can sent the picture to you respectively for
your reference.
Thanks in advance.
Best regards,
zhang shoukai
PE, Huawei Technologies
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