Copper is plated to aluminium with a nickel barrier.
I don't know the specific process involved but is a normal/commercialised
process as for example, large numbers of plated aluminium
packages/components / filters boxes etc are used in volume RF applications.

BTW: Check out TEC issues if using filled epoxies with aluminium,  there is
a big on paper mismatch. Depending on size etc, there might be an in use
problem. Also electrically conductive adhesives will quickly go electrically
insulating at Ag/Al interface, [but will remain OK thermally.]


Mike Fenner
Indium Corporation of Europe
T: + 44 1908 580 400
F: + 44 1908 580 411
M: + 44 7810 526 317
W: www.indium.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Albin, David
Sent: Friday, June 29, 2001 8:45 AM
To: [log in to unmask]
Subject: Re: [TN] Copper Plating Aluminum


Phil,
        rather than plating the through holes, why not fill with a screen
print/ thermal cure conductive? The effectiveness of this method may depend
on hole diameter & panel thickness.....
just a thought.

David Albin
Coates Circuit Products

-----Original Message-----
From: Phillip E. Hinton [mailto:[log in to unmask]]
Sent: 29 June 2001 05:45
To: [log in to unmask]
Subject: [TN] Copper Plating Aluminum


All

Some designer has called out a plated-thru PC board that has copper layers
and aluminum cores joined by plated thru copper holes.  I am aware of two
lousy methods that have been used.  One is to use electroless nickle instead
of electroless copper to give a metallic coating in the holes prep the
holes.
 A zincate process precedes the electroess nickel.  The second is to use a
board that has been zincated and use pryo copper asa a plating solution.

Does anybody have any other less difficult magical solution(s)

Thanks
Phil Hinton

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