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July 2001

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Subject:
From:
"Lam, Patrick" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Jul 2001 09:40:43 -0700
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Hi TechNet's,

Would some of you tell me the proper way to handle this:

I have 10 mil through hole vias on BGA pads. Is solder plugging these vias
on the BGA side the proper way? What is the proper way to document this on
the Fab. drawing?

Thanks,

Patrick Lam
Phone:(604)293.4392

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