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July 2001

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Subject:
From:
Barry Gallegos <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Jul 2001 07:02:25 -0600
Content-Type:
text/plain
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text/plain (136 lines)
Good morning TN's
Mr. Hogan I believe I too would like to have a copy of Rheology -Vs- Print,
101.

Barry Gallegos
Process Engineer
Western Electronics
1550 S. Tech Lane
Meridian, Idaho, 83642
P- 208.955-9771
F- 208.955-9755


-----Original Message-----
From: James-Kester [mailto:[log in to unmask]]
Sent: Thursday, July 05, 2001 3:47 AM
To: [log in to unmask]
Subject: Re: [TN] Solder stencil printing validation


Dear Mr. Hoggan ,

I appreciate if can get your "paste rheology vs print, 101"

Best regards,

James Wang
Litton Components
[log in to unmask]
Tel . 886-2-89121066
Fax . 886-2-89121072

-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Andrew Hoggan
Sent:   Tuesday, July 03, 2001 2:40 AM
To:     [log in to unmask]
Subject:        Re: [TN] Solder stencil printing validation

If you're trying to develop parameters that determine whether the print
process is in spec or whether the solder paste is within spec or if you
trying to determine which part of the process is not within specification,
then you must understand or know the dynamic rheology response of the solder
paste with respect to yield stress, recovery, and frequency response.

You can forget about relative viscosity such as that generated by Malcom or
Brookfield types of measurement and the much quoted thixatropic indices or
'rheology curves';  you need to know the absolute dynamic rheology of the
material.

If you want to know more contact me offline, I can send you 'paste rheology
vs. print, 101'.

Best regards,


Andrew Hoggan
BBA Associates Ltd
www.bba-associates.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Carroll, George
Sent: Monday, July 02, 2001 07:25
To: [log in to unmask]
Subject: [TN] Solder stencil printing validation


I'm looking for references or written guides and any helpful recomendations
to identify parameters to investigate and construct a robust and meaningful
solder paste stencil printing process validation.  After checking through
the archives, I found a posting which pointed to an FDA document.  Alas, the
document no longer exists.  I'm looking to find what observations and
measurments other than the obvious accuracy, volume, height and paste age.

George Carroll
Process Engineer, Siemens Energy & Automation
P.O. Box 1255
3000 Bill Garland Road
Johnson City, TN 37605
(423) 461-2948
[log in to unmask]

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