Dang it, Doug, you filled your Omega Meter with it.
Brian
[log in to unmask] wrote:
>
> Because a few of the "icons" of the industry(Doug Pauls,etc.) tell you to.
> Unless you have a Freudian sense of humor,which can be attributed to
> drinking too much Mountain Dew(Doug Pauls,etc.),I believe you meant to say
> ionic wash.
> There are many reasons to clean an assembly,besides just removing flux or
> it's postreflow by-products.Knowing the end use enviroment,whether it is to
> be conformally coated,as well as many other factors will determine whether
> you need to clean after a no-clean process.If you would to talk to me
> off-line give me a call.
> Doug Pauls is also an excellent source of information.
>
> **Oh, hell. Now I have to buy Dewey another beer at IPC. "Industry
> Icon?". That means when you click on me, I crash and give you the blank
> look of the Blue Screen of Death. Any time someone mentions my name three
> times in an e-mail, I turn into a large Norwegian rat for 1 day. Thanks a
> lot, Dewey.
>
> The way I read the original question, I don't know if Cathy was referring
> to the final rinsing, a general cleaning, or to the ROSE/SEC cleanliness
> test.
>
> I don't disagree with any of the former commenters, but the issue of
> cleaning and cleanliness can be a complex one. If you have an assembly
> process which incorporates cleaning, then you have the opportunity to
> remove residues. If you have a no-clean assembly process, you must
> determine, in advance, if the constituent parts (boards and components) are
> clean enough to avoid electrochemical failures. How clean is clean enough?
> A very difficult question to answer and can only be done on a case by case
> basis in my opinion.
>
> I would recommend that you get the following documents to assist in your
> education on the matter:
>
> IPC-TP-1115: SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE
> NO-CLEAN PROCESS. This document discusses all the factors that an
> assembler has to consider, cleanliness being a big one, when switching to
> no-clean assembly methods.
>
> IPC-HDBK-001: This document is a companion to J-STD-001. I was the editor
> or writer for sections 4 (Fluxes) and 8 (Cleaning and Cleanliness). It
> goes into the various cleanliness tests and cleaning in general. I
> understand that a similar document is being initiated as a companion to
> IPC-A-610.
>
> EMPF Report RR0013: An In-Depth Look at Ionic Cleanliness Testers. This
> may also be available as an IPC technical paper. If not, the paper is
> available from www.empf.org. The paper discusses ROSE/SEC testers and why
> they should be used ONLY for process control and not product acceptance.
>
> I authored a column for Circuits Assembly Magazine
> (www.circuitsassembly.com) called Process Rx for a number of years, with
> topics including cleaning and cleanliness testing. You can check their
> archives or the Library section of CSL (www.residues.com) for copies.
>
> I wrote two articles for the October and November 2000 IPC Review on bare
> board cleanliness specifications and assembly cleanliness specifications in
> general.
>
> Jack Brous, often considered the father of the Omegameter, wrote a paper
> that outlined the origins of the ROSE test and how it can and can't be
> used. IPC should have it as a technical paper. If not, I have it around
> here somewhere.
>
> If that is not enough to put you to sleep, I wrote another few documents
> called the Layman's Guide to MIL-STD-2000A and the Layman's Guide to
> J-STD-001B. They cover the aspects of cleaning and qualifying the process.
>
> Well, that should be enough for a start. Let me know if I can help some
> more.
>
> Doug Pauls
> Rockwell Collins
> Industry Court Jester
>
> (Now where did I put that Mountain Dew.....)
>
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Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
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