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July 2001

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Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 30 Jul 2001 09:37:35 -0500
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Hello Mark,
We use an Agilent 5DX to inspect all BGA assy's. It incorporates a process to inspect solder joints in 3d. It is, however, not cost-effective for what you are needing. You might want to find someone who has an Ersascope. It looks under BGA's with a right-angle lens. If you are looking for voiding, for instance, then you'll have to find another X-ray method. Hope this helps.


>>> [log in to unmask] 07/30/01 08:56AM >>>
We have a BGA we need to inspect.  However, the kicker is that
directly below the BGA there is a socket adapter and we have tried
XRAY and it fails miserably.

Does anyone out there inspect UNDER a BGA once it is soldered in place
with a boroscope or fiber optic camera?  Thanks.

Mark Ross
PCB Designer
Accurate Technologies

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