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July 2001

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Subject:
From:
Jean-Luc Lehmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 30 Jul 2001 10:15:14 +0200
Content-Type:
text/plain
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text/plain (58 lines)
This is a late response but...

You should have a look at application note 00-08-01 on the www.synqor.com
web site.
It is about "Thermal & Reliability Study on High Curretn Thermal Vias &
Output Pins" and may be of help.

Jean-Luc Lehmann




                    "<Darrel
                    Therriault>"         To:     [log in to unmask]
                    Sent by:             cc:
                    TechNet              Subject:     [TN] Thermal Relief
                    <[log in to unmask]
                    ORG>


                    05.06.01
                    22:57
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
                    respond to
                    darrelt





TechNet,


Is there a standard calculation or geometry for creating a thermal relief
on a plane/pth connection?  This is for power pins on a connector and


to enable it to be desoldered more easily, having a thermal relief was
suggested.


Tks......DT

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