I haven't got any data analysis but the main issues I asw with water soluble is that the
organic acids in the flux are good for soldering pretty much anything. The high activity is
good for soldering but then you have to get the activators off to prevent corrosion effecting
the long term operation of your product. If you have large QFP's on or components which sit
close to the PCB surface you have to get the water under the component to remove the flux. Now
the surface tension of water makes this difficult so you can add saponifiers to help reduce
this tension, which mean the wash water will now go under the component, but how do you get
the rinse water under the component to remove the cleaning agents?

Steve

"Golembiewski, Ray" wrote:

>         I am looking for data analysis between a water soluble flux, and
> an RMA. What are the major effects each has on a PCB. What do I have to
> know before I make a switch from RMA to water soluble. If you might be
> able to direct me to a link, or send me some information it would be
> greatly appreciated. Thanks again,
>
> Ray Golembiewski C.I.D.
> IPC Certified Interconnect Designer
> Manufacturing Test Engineer
> Projects Unlimited, Inc.
> (937) 918-2200
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------