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July 2001

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Subject:
From:
Dan Fazioli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Jul 2001 14:57:34 -0400
Content-Type:
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Hi Rick,

I am sure that you will get an avalanche of feedback on this question.
Nevertheless, although there are a number of factors that are involved with the
long-term reliability of CBGA's, the answer to your question highly depends upon
the maximum physical size and the number of solder balls the CBGA's have when
they are mounted onto the FR4 PWB, and then exposed to a specific number of
temperature cycling regimes that have the extremes that you stated.  However,
there is a goodly amount of published data available on this subject.  I suggest
you contact Mr. Werner Engelmaier, who is an expert in this area.

best regards,

faz

____________________Reply Separator____________________
Subject:    [TN] Ceramic BGA's on FR4,any thermal coefficient problems
Author: Rick Summers <[log in to unmask]>
Date:       7/26/2001 12:54 PM

Has there been any studies completed to prove or disprove thermal
coefficient problems between ceramic BGA's mounted on FR4 causing long term
reliability problems of the BGA balls (solder ball separating from PWB) over
commercial and industrial temperature ranges?
Commercial temp range: 0O C to +70 O  C.
Industrial temp range: -40 O C to + 80 O  C.

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