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July 2001

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Subject:
From:
"Kasprzak, Bill (sys) USX" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Jul 2001 07:54:02 -0400
Content-Type:
text/plain
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text/plain (81 lines)
To all:

I've been reading, with great interest, the responses so far to the use of
2% silver paste. I am not being critical of the folks who responded so far
but, each one cites a "reported" or "understood" advantage to using 2%
paste.

I have also heard some of same reasons for considering a switch to a 2%
silver paste. Can any of the metallurgists on this forum confirm some of
these reported advantages and perhaps recommend that given x,y, and z, one
should consider using 2% silver solder alloys?

Good topic.

Bill Kasprzak
Moog Inc., Electronic Assembly Engineering


> -----Original Message-----
> From: Eric Christison [SMTP:[log in to unmask]]
> Sent: Thursday, July 26, 2001 4:20 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] solder paste with 2% silver
>
> > I always understood that you had to use a paste with 2% silver if you
> >  were using components
> > with terminations containing Palladium. The 2% silver is also supposed
> to
> >  five you a shinier
> > finished solder joint.
> >
> > Steve.
> >
> > Larry Koens wrote:
> >
> > > Got a question for everyone,
> > >
> > > I just switched companies and the new company that I'm with now uses a
> > > 62/36/2 solder paste. I've always used the 63/37 formula. The guys who
> > > decided to use the 2% silver are no longer with the company. My
> >  question
> > > to you is, why would they want the 2% silver in the paste? They know
> > > something I don't?!
> > >
>
> The silver should give the alloy higher strength, better creep resistance
> and a higher melting point. Perhaps your application benefits from one of
> these differences?
>
> Regards,
>
>
>
> Eric Christison
>
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