Dear Technetters,

Again I need your help.  I want to test the adhesion
of BGA pads using, "Perpendicular Pull Method" tests ,
Per IPC-650, Method Number 2.4.21.1, on some sample
Circuit Boards being manufactured for us.  My
questions:

1.    Is this the correct method number for doing a
pull test on a BGA pad?

2.   Is there an industry standard "pull test value"
for a 0.028 diameter BGA pad?

3.   The "standard headed pin" that is soldered to the
pad per the aforementioned test method, is to have a
head diameter of 0.047 inches.  What issues should I
be looking for when the "nail head" is bigger than the
pad?

4.   Are there any know "land mines" (potential
problems) that I should be made aware of?

5.  Do you know of anyone that can (or will) perform
the test?

As always, your input is valued and appreciated.

Thanx

Bill Butman
Circuit Technology Center
[log in to unmask]

=====
Bill Butman
Circuit Technology Center
45 Research Drive
Haverhill, MA 01832

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