I need your advice. Any information would be helpful.

My boss asked me to check into the dimension feasibility of
putting LICA in the Flip chip packages, such as,  What is the clearance
between the edge of the die to the edge
of heat sink we need for LICA?  How about the thickness of LICA vs. the
heat sink?  I will use uF range of LICA for my study.

Thanks,

YL

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