Julien,

I heard from someone that a solder iron tweezer was good. Two separate
solder tips will not work. The part is and the land pads are too small.
Exactly what process a person would use I do not know. For instance, would
it work to be putting solder down, placing the part and remelting, or
putting solder on one pad then heating and placing the part and filling in
the other pad. It is tough to rework 0402's and 0201's because both the part
size and the layout that is recommended now adays. If you are working on a
RF circuit there is evidence, though acceptable per IPC specs, that flux
residue and the reworked solder joint will "detune" the assembly.

I have been trying to figure out how to remove/wick/suck solder off these
tiny land pads that are so closely spaced and not take the pad too. Is there
equipment that can doo this delicate process or will boards have to be
tossed each time?

Dorothy Lush

> ----------
> From:         Julien Bouchard[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Julien Bouchard
> Sent:         Wednesday, July 18, 2001 7:31 AM
> To:   [log in to unmask]
> Subject:      Rework of 0201 components
>
> Hi everybody,
>         We will soon start to use 0201 component for some tests.  The
> placement and
> the print seem to be ok, but we still have some interogation about the
> rework of theses components.  They are really difficult to handle and to
> solder. Anybody have some advice for the reworks of these so much littles
> components ??? Thank you.
>
> Julien Bouchard
>
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