Hello All,
An engineering  mistake at the PCB fabricator caused a deviation at the
drilling size of some press fit connectors (the tools were designed to HAL
when the coating was Ni-Gold). I wonder if an addition selective HAL on the
component's area (with the NI-Au) can be implemented and still stay with
high reliability boards (with reference to the brittle intermetalics alloy
that can be formed with time at that area). I have to say that those bare
boards are very expensive and complicated(28 layers, 18"x18")

Tamir B. Shoshan

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