I highly recommend a book by George Harman "Wire Bonding in
Microelectronics"  Materials. Processes, Reliability and Yield.

IMHO,  For Thermosonic Gold Ball Bonding :   45 microinches of
Electrolytic Soft Au. over 155 microinches of Ni.

        If you are doing Al. Ultrasonic Wedge Bonding, your material
possibilities are increased, (immersion Au. etc.)

Bill C.
NorLux Corp.

-----Original Message-----
From: Buscomb, Scott [mailto:[log in to unmask]]
Sent: Monday, July 02, 2001 9:36 AM
To: [log in to unmask]
Subject: [TN] Specs for Wire Bond Pads


I am looking for information on specifying a gold plated surface for
wire
bond pads, specifically plating, surface roughness and contamination.
Does a
standard industry spec exist? Is there an authoritative text on the
subject?
Thanks in advance.

Scott Buscomb

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