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July 2001

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Subject:
From:
Craig Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Jul 2001 10:33:35 -0400
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Edwin,

The major concern over popcorning is delamination on top of the die. This
can lead to condensation, which can cause ECM between ball bonds or
corrosion of the bond pads. It can also cause shifting, which lead to
fatigue of the ball bonds and eventual liftoff.

I would strongly recommend not using these components.

Craig

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Louis, Edwin @ CSE
Sent: Thursday, July 12, 2001 9:30 AM
To: [log in to unmask]
Subject: [TN] PEMs


If one receives PEMs from the manufacturer which are supposedly dry and
handled correctly but are found to have internal delamination
by acoustic spectroscopy, whether this is an automatic sentence of
popcorning when the devices are put through convection reflow. Is there air
inside the part that can cause popcorning of a dry part when no outward
signs of delamination or popcorning is visible.Also,

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