Scott,

There is no standard.  Plating will depend on bond process, wire metallurgy,
substrate or board material, compatibility with other processes and trade
offs between process robustness, cost and end use environmental conditions.
You can contact me off line if you would like to get into specifics.

Regards,
Bruce Misner

> ----------
> From:         Buscomb, Scott[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Buscomb, Scott
> Sent:         Monday, July 02, 2001 10:36 AM
> To:   [log in to unmask]
> Subject:      [TN] Specs for Wire Bond Pads
>
> I am looking for information on specifying a gold plated surface for wire
> bond pads, specifically plating, surface roughness and contamination. Does
> a
> standard industry spec exist? Is there an authoritative text on the
> subject?
> Thanks in advance.
>
> Scott Buscomb
>
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