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Subject:	Re: PCB surface finishes
From:	Andrew Hoggan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 11 Jul 2001 22:27:57 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (56 lines)

Possibly the concern comes through a lack of control in applying immersion
gold compared to other forms of plating. If there is too much gold, then the
intermetallic formed on soldering would potentially interfere with the
solder joint integrity, potentially causing fracture. I couldn't speculate
further without more information on your concern.

Andrew Hoggan
BBA Associates Ltd
www.bba-associates.com

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Shoukai Zhang
Sent: Wednesday, July 11, 2001 10:27
To: [log in to unmask]
Subject: [TN] PCB surface finishes


Dear TechNetters:

As we know that the preferred metal surface finishes are HASL, EN/IG
(Electroless Nickel and Immersion Gold, and OSP etc.

It's reported that EN/IG(also called immersion gold) suface may lead
unreliable solder joint for BGA component,  and suggest do not use
immersion gold for designs that have BGAs.

Please give your advices.

Thanks with best regards,
Zhangshoukai, PE, Huawei Technologies.

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