TECHNET Archives

July 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ralph Zhao <[log in to unmask]>
Reply To:
Date:
Wed, 11 Jul 2001 21:56:47 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines)
Mr Zhang
  I do think that EN/IG is a excellent way for PCB surface finsh treat if we
could do a good control for the gold thickness and Nickel qulity.As we
known,the gold layer will be removed in the solding procedure. A thin gold
layer will protect the nickel which have a good soldability. Or you can
select immersion tin procedure. Chemical deposit surface finsh like
immersion gold,tin or silver is provided with a well contributed plating
layer. it will be good for BGA solding!
  I'm not a export for this field,I just want to show my idea!


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Shoukai Zhang
Sent: Wednesday, July 11, 2001 05:27 PM
To: [log in to unmask]
Subject: [TN] PCB surface finishes


Dear TechNetters:

As we know that the preferred metal surface finishes are HASL, EN/IG
(Electroless Nickel and Immersion Gold, and OSP etc.

It's reported that EN/IG(also called immersion gold) suface may lead
unreliable solder joint for BGA component,  and suggest do not use
immersion gold for designs that have BGAs.

Please give your advices.

Thanks with best regards,
Zhangshoukai, PE, Huawei Technologies.

----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2