Hi folks,

We encountered “blowholes” occurring on our PCB Assembly after wave
soldering. And the cross-section pictures show out, there’s no void in the
through-hole, and the excess solder(solder ball)on the soldering side of
the board connects the inner solder of through-hole directly. Now I have
some questions about the “blowhole”:

1. Is it real blowhole?
2. According to IPC standards, the process phenomena can be recognized as
process-defect or process-indicator? And will you help to tell me the
detailed lines in IPC which used for supporting your conclusion.
3. What’s your recommendation about the excess-solder reworking on the
board? Or no need for reworking?


If received your response, I can sent the picture to you respectively for
your reference.

Thanks in advance.

Best regards,
zhang shoukai

PE, Huawei Technologies

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------